SEMICONDUCTOR COMPONENTS INDUSTRIES VIA TECHNOLOGIES AIRBUS SE ALTRIA CLIENT SERVICES EVONIK ROHM AMGEN WAYNE STATE UNIVERSITY JNC PETROCHEMICAL (SEKIYU KAGAKU) NOVOZYMES COLUMBIA UNIVERSITY PANASONIC SIZE TECHNOLOGIES WYETH CHEVRON HOECHST MARION ROUSSEL (HMG) MERCK PATENT KONICA MINOLTA 3M BT (BRITISH TELECOMMUNICATIONS) TECUMSEH PRODUCTS BAYER INTELLECTUAL PROPERTY DEUTSCHES KREBSFORSCH BUFFALO KEIHIN GAMBRO LUNDIA UNIVERSITY OF MICHIGAN EBAY AVAGO TECHNOLOGIES GENERAL IP JIMMY STYKS HALDOR TOPSOE LITTON SYSTEMS HERCULES U PHILIPS HERCULES CREDIT PACESETTER US SYNTHETIC AXIS ASAHI KASEI UNITED STATES (US) NAVY ORACLE INTERNATIONAL AGFA HEALTHCARE NOKIA SOLUTIONS & NETWORKS BASF PERFORMANCE PRODUCTS JUNIPER NETWORKS ZANGO BOSTON SCIENTIFIC SCIMED APPLE SCHAEFFLER TECHNOLOGIES ARVINMERITOR TECHNOLOGY VOLVO NIHON KOHDEN C.R.F. SOCIETA CONSORTILE PER AZIONI (CRF SCPA) TOKYO ELECTRON (TEL) DELTA ELECTRONICS STMICROELECTRONICS MOSAID TECHNOLOGIES CADENCE DESIGN SYSTEMS NORTEK RENISHAW BRIDGESTONE LANTIQ BETEILIGUNGS ROCKWELL AUTOMATION TECHNOLOGIES YOSHINO KOGYOSHO TOMTOM INTERNATIONAL SAVAGE ARMS DAIMLER PRESIDENT AND FELLOWS OF HARVARD COLLEGE (HARVARD UNIVERSITY) FAR EAST DEVELOPMENT BETZDEARBORN LAWRENCE LIVERMORE NATIONAL SECURITY (LLNS) PPG INDUSTRIES XEROX WISTRON NEWEB ORACLE SK HYNIX LAPIS SEMICONDUCTOR COMMSCOPE TECHNOLOGIES DENSO FISHER & PAYKEL HEALTHCARE COLEMAN POWERMATE COMBUSTION ENGINEERING AGCO ABB (ASEA BROWN BOVERI) ASSOCIATED PRODUCTS INTERNATIONAL AUTOMOTIVE COMPONENTS (IAC) GROUP NOKIA BELL LABS SEIKO INSTRUMENTS (SII) MITSUMI ELECTRIC ITW (ILLINOIS TOOL WORKS) LENOVO FUJITSU SEMICONDUCTOR INTERDIGITAL TECHNOLOGY GLOBALFOUNDRIES EXEDY COMPUTER ASSOCIATES THINK SMC SZ DJI TECHNOLOGY ABB (ASEA BROWN BOVERI) TECHNOLOGY AKZO NOBEL (NASH) MICROCHIP TECHNOLOGY